Screenshot of a word salad news article: Congatec conga-TCRP1 is a COM Express 3.1 Type 6 Compact module powered by the newly announced AMD Ryzen AI Embedded P100 Series processors, which feature AMD’s latest Zen 5 architecture, RDNA 3.5 graphics, and an XDNA 2 NPU for 59 TOPS of combined AI performance, including up to 50 TOPS from the NPU. The module supports up to 96 GB of DDR5-5600 memory and is available in 4-core and 6-core variants with a configurable 15 W to 54 W TDP,